US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Sept. 29 for "Apparatus and methods for chemical mechanical polishing" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,746,636, issued on Sept. 29, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Apparatus and methods for chemical mechanical polishing" was invented by Te-Chien Hou (Kaohsiung, Taiwan), Chih Hung Chen (Hsinchu, Taiwan), Kang Huang (Hsinchu, Taiwan), Wen-Pin Liao (Hsinchu, Taiwan), Shich-Chang Suen (Tainan, Taiwan) and Kei-Wei Chen (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of the present disclosure relate a CMP tool and methods for planarization a substrate. Particularly, embodiments of the present disclosure provide a substrate transporter for use in a CMP tool. The transporter may be ...