US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 22 for "Semiconductor devices and methods of manufacture" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,583, issued on Sept. 22, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor devices and methods of manufacture" was invented by Chia-Yang Hung (Kaohsiung City, Taiwan), Huan-Just Lin (Hsinchu, Taiwan), Sheng-Liang Pan (Hsinchu, Taiwan), Yungtzu Chen (Hsinchu, Taiwan), Po-Chuan Wang (Taipei City, Taiwan) and Guan-Xuan Chen (Taoyuan City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor devices and methods of manufacturing the semiconductor devices are described herein. A method includes forming a first opening through a dielectric layer, the first opening exposing a conductive region. A w...