ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,603, issued on Sept. 22, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Pick-and-place tool with warpage-correction mechanism" was invented by Jen-Yuan Chang (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A suction head of a pick-and-place tool for semiconductor device packaging is provided. The suction head includes: a suction unit configured to apply a suction force on a top die and pick the top die; and a warpage-correction mechanism. The warpage-correction mechanism includes a pushing mechanism, and the pushing mechanism includes a plurality of pushing units, each of the plurality of pushing uni...