ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,468, issued on Sept. 1, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Interconnect structure pattern" was invented by Fu-Chiang Kuo (Hsinchu City, Taiwan), Guan Yu Chen (New Taipei City, Taiwan) and Hsin-Liang Chen (Hsinchu City, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure describes a structure with a substrate, a circuit element, a first metallization layer, and a second metallization layer. The circuit element is formed on the substrate. The first metallization layer is disposed over the substrate and includes a first metal line electrically connected to the circuit element and fir...