US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Oct. 6 for "Semiconductor structure and method for measuring the optical die" (Taiwanese, American Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,754,368, issued on Oct. 6, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor structure and method for measuring the optical die" was invented by Tai-Chun Huang (New Taipei City, Taiwan), Chia-Ju Yu (Taichung City, Taiwan) and Stefan Rusu (Sunnyvale, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes an optical die, a first edge coupler, and a reflective layer. The optical die has a top surface and an edge. The first edge coupler is disposed in the optical die and adjacent to the edge of the optical die. The reflective layer is disposed in the optical die and adjacent to...