US Patent Issued to Taiwan Semiconductor Manufacturing on Oct. 6 for "Semiconductor device and method of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,802, issued on Oct. 6, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor device and method of forming the same" was invented by Rui-Wen Song (Hsinchu County, Taiwan), Po-Yuan Teng (Hsinchu City, Taiwan), Hao-Yi Tsai (Hsinchu City, Taiwan), Chia-Hung Liu (Hsinchu City, Taiwan) and Shih-Wei Chen (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a die, a redistribution layer (RDL) structure including a first polymer layer, a second polymer layer and a UBM layer. The die is encapsulated by an encapsulant. The RDL structure is disposed over the encapsulant. Th...