US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Oct. 6 for "Semiconductor arrangement and method for making" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,752,317, issued on Oct. 6, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd. (Hsin-Chu, Taiwan).

"Semiconductor arrangement and method for making" was invented by Eason Chen (Hemei Township, Taiwan), Yi-Fam Shiu (Toufen City, Taiwan), Sung-Chun Yang (Hsinchu City, Taiwan), Hsu-Shui Liu (Pingjhen City, Taiwan), Yang-Ann Chu (Hsinchu City, Taiwan) and Jiun-Rong Pai (Jhubei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A cleaning apparatus, method, and dry chamber are provided for cleaning a wafer carrier that holds wafers as part of a semiconductor fabrication process. The cleaning apparatus includes a wet chamber that receives ...