US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Oct. 6 for "Package structure with protective lid" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,797, issued on Oct. 6, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Package structure with protective lid" was invented by Meng-Tsung Kuo (Tainan City, Taiwan), Hui-Chang Yu (Hsinchu County, Taiwan), Chih-Kung Huang (Hsinchu, Taiwan) and Wei-Teng Chang (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure is provided. The package structure includes a chip-containing structure over a substrate and a first adhesive element directly above the chip-containing structure. The first adhesive element has a first thermal conductivity. The package structure also includes multiple second ...