US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Oct. 27 for "Backside metal rom device, layout, and method" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,638, issued on Oct. 27, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Backside metal rom device, layout, and method" was invented by Chien-Ying Chen (Hsinchu, Taiwan), Ku-Feng Lin (Hsinchu, Taiwan) and Preciliano Asinas Ruiz Jr. (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A read-only memory (ROM) array includes first through fourth rows of four ROM bits positioned along respective first through fourth active areas in a front side of a semiconductor substrate, first through fourth metal lines aligned with the first through fourth active areas in a first direction and positioned in a first fron...