US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Oct. 20 for "Probe head structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,768,860, issued on Oct. 20, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Probe head structure" was invented by Wen-Yi Lin (New Taipei City, Taiwan), Hao Chen (New Taipei City, Taiwan), Chuan-Hsiang Sun (Taoyuan City, Taiwan), Mill-Jer Wang (Hsinchu, Taiwan), Chien-Chen Li (Hsinchu, Taiwan) and Chen-Shien Chen (Zhubei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A probe head structure is provided. The probe head structure includes a flexible substrate having a top surface and a bottom surface. The probe head structure includes a first probe pillar passing through the flexible substrate. The probe head...