US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Nov. 4 for "Method of manufacturing semiconductor devices and semiconductor devices" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,464,814, issued on Nov. 4, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Method of manufacturing semiconductor devices and semiconductor devices" was invented by Kuan-Ting Pan (Taipei, Taiwan), Kuo-Cheng Chiang (Zhubei, Taiwan), Shi Ning Ju (Hsinchu, Taiwan), Yi-Ruei Jihan (Keelung, Taiwan), Wei Ting Wang (Taipei, Taiwan) and Chih-Hao Wang (Baoshan Township, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In a method of manufacturing a semiconductor device, a fin structure including a stacked layer of first semiconductor layers and second semiconductor layers is formed, an isolation insulating layer is formed s...