US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Nov. 4 for "Chip structure and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,166, issued on Nov. 4, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Chip structure and method for forming the same" was invented by Hui-Min Huang (Taoyuan, Taiwan), Ming-Da Cheng (Taoyuan, Taiwan), Wei-Hung Lin (Xinfeng Township, Taiwan), Chang-Jung Hsueh (Taipei, Taiwan), Kai-Jun Zhan (Taoyuan, Taiwan) and Yung-Sheng Lin (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip structure is provided. The chip structure includes a substrate. The chip structure includes a first conductive line over the substrate. The chip structure includes an insulating layer over the substrate and the first conduct...