US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 3 for "Package on package structure with encapsulated heat sink" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,860, issued on Nov. 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package on package structure with encapsulated heat sink" was invented by Lipu Kris Chuang (Hsinchu City, Taiwan), Hsin-Yu Pan (Taipei, Taiwan) and Tzu-Sung Huang (Tainan City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure including a chip stacking structure, a thermal enhance component and a first insulating encapsulant is provided. The thermal enhance component is stacked over and thermally coupled to the chip stacking structure, wherein a first lateral dimension of the thermal enhance component is greater than a second...