US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 3 for "Method of forming patterns, package, and manufacturing method of package" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,729, issued on Nov. 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Method of forming patterns, package, and manufacturing method of package" was invented by Yi-Chun Huang (Miaoli County, Taiwan) and Li-Hsuan Chen (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of forming patterns includes at least the following steps. A first dielectric layer having a first opening is provided. A first seed layer and a first conductive layer are deposited in the first opening. A portion of the first conductive layer is removed to form a recess. A vacancy migration blocking layer and a second conductive laye...