US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 3 for "Method of forming a plurality of conductive interconnect structures for circuit probe testing of an integrated circuit structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,782,386, issued on Nov. 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Method of forming a plurality of conductive interconnect structures for circuit probe testing of an integrated circuit structure" was invented by Shu-Cheng Chin (Hsinchu, Taiwan) and Kong-Beng Thei (Pao-Shan Village, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Some embodiments relate to a method of an integrated circuit structure having a conductive structure for circuit probe testing. The method includes providing an integrated circuit structure including a substrate, a dielectric structure disposed over the substrate, and a plurality of ...