ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,197, issued on Nov. 18, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).
"Semiconductor device" was invented by Ching-Yu Huang (Hsinchu, Taiwan), Shih-Wei Peng (Hsinchu, Taiwan), Chia-Tien Wu (Taichung, Taiwan), Wei-Cheng Lin (Taichung, Taiwan) and Jiann-Tyng Tzeng (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes first and second conductive layers, a first epitaxial structure and a first via structure. The first conductive layer extends along a first direction, and provides a first reference voltage signal. The second conductive layer extends along the first direction, ...