US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on May 5 for "Methods of manufacturing pellicle for EUV lithography masks" (Taiwanese Inventors)

ALEXANDRIA, Va., May 5 -- United States Patent no. 12,619,142, issued on May 5, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Methods of manufacturing pellicle for EUV lithography masks" was invented by Ting-Pi Sun (Taichung City, Taiwan), Pei-Cheng Hsu (Taipei, Taiwan) and Hsin-Chang Lee (Zhubei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In a method of manufacturing a pellicle for an extreme ultraviolet (EUV) photomask, a nanotube layer including a plurality of carbon nanotubes is formed, the nanotube layer is attached to a pellicle frame, and a solvent dipping treatment is performed to the nanotube layer by applying bubbles in a solvent to the nanotube...