US Patent Issued to Taiwan Semiconductor Manufacturing on May 26 for "Tapered backside ground structure for pixel array" (Taiwanese Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,641,906, issued on May 26, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Tapered backside ground structure for pixel array" was invented by Yu-Wei Huang (Tainan City, Taiwan), Chen-Hsien Lin (Tainan City, Taiwan) and Shyh-Fann Ting (Tainan City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Some embodiments relate to an integrated chip including a semiconductor substrate and a pixel array comprising a plurality of photodetectors in the semiconductor substrate. The pixel array further comprises a plurality of transistors on a frontside of the semiconductor substrate. A backside ground (BSGD) structure extends into...