US Patent Issued to Taiwan Semiconductor Manufacturing on May 26 for "Device with modified work function layer and method of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,641,860, issued on May 26, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Device with modified work function layer and method of forming the same" was invented by Yu-Chi Pan (Zhubei, Taiwan), Kuan-Wei Lin (Tainan, Taiwan), Chun-Neng Lin (Hsin-chu, Taiwan), Yu-Shih Wang (Tainan, Taiwan), Ming-Hsi Yeh (Hsinchu, Taiwan) and Kuo-Bin Huang (Jhubei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a plurality of fin structures disposed over a substrate and a work function alloy layer disposed over each fin structure of the plurality of fin structures. The plurality of fin structures includes...