US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on May 19 for "Semiconductor structure including different devices and methods for manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,183, issued on May 19, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor structure including different devices and methods for manufacturing the same" was invented by Cheng-Ting Chung (Hsinchu, Taiwan), Yi-Bo Liao (Hsinchu, Taiwan) and Jin Cai (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes a substrate, a first device unit and a second device unit. The substrate includes a first region and a second region. The first device unit is disposed on the first region, and includes a plurality of first channel portions and two first source/drain portions. The se...