US Patent Issued to Taiwan Semiconductor Manufacturing on May 19 for "Packages with photonic engines and method of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,631,823, issued on May 19, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Packages with photonic engines and method of forming the same" was invented by Hsing-Kuo Hsia (Jhubei, Taiwan), Chen-Hua Yu (Hsinchu, Taiwan) and Jui Lin Chao (New Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes patterning a top silicon layer in a substrate to form a plurality of photonic devices. The substrate includes the top silicon layer, a first dielectric layer under the top silicon layer, and a semiconductor layer under the first dielectric layer. The method further includes forming a second dielectric layer to...