US Patent Issued to Taiwan Semiconductor Manufacturing on May 19 for "Package structure and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,581, issued on May 19, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (hSINCHU, Taiwan).

"Package structure and method for forming the same" was invented by Wei-Yu Chen (Hsinchu cITY, Taiwan) and Chien-Hsun Lee (Hsin-chu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure including a first semiconductor die, at least one second semiconductor die conductive terminals and an insulating encapsulation is provided. The at least one second semiconductor die is stacked on and electrically connected to the first semiconductor die. The conductive terminals are disposed on and electrically connected to the first semic...