ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,652, issued on May 13, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Substrate and package structure" was invented by Wei-Hung Lin (Xinfeng Township, Taiwan), Hsiu-Jen Lin (Zhubei, Taiwan), Ming-Da Cheng (Taoyuan, Taiwan), Yu-Min Liang (Zhongli, Taiwan), Chen-Shien Chen (Zhubei, Taiwan) and Chung-Shi Liu (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "According to an exemplary embodiment, a substrate having a first area and a second area is provided. The substrate includes a plurality of pads. Each of the pads has a pad size. The pad size in the first area is larger than the pad size in the second ar...