US Patent Issued to Taiwan Semiconductor Manufacturing on May 13 for "Interposer with die to die bridge solution and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,619, issued on May 13, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Interposer with die to die bridge solution and methods of forming the same" was invented by Hsien-Wei Chen (Hsinchu, Taiwan) and Shin-Puu Jeng (Po-Shan Village, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a plurality of inorganic dielectric layers including a plurality of metal interconnect layers formed therein and a plurality of first contact pads, a plurality of organic dielectric layers disposed on and electrically connected to the plurality of inorganic dielectric layers and including a plurality of m...