US Patent Issued to Taiwan Semiconductor Manufacturing on May 13 for "High efficiency heat dissipation using discrete thermal interface material films" (Taiwanese Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,568, issued on May 13, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"High efficiency heat dissipation using discrete thermal interface material films" was invented by Yu Chen Lee (Hsinchu, Taiwan), Shu-Shen Yeh (Taoyuan, Taiwan), Chia-Kuei Hsu (Hsinchu, Taiwan), Po-Yao Lin (Zhudong Township, Taiwan) and Shin-Puu Jeng (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes: a substrate; a package attached to a first surface of the substrate, where the package includes: an interposer, where a first side of the interposer is bonded to the first surface of the substrate through...