US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on May 12 for "Semiconductor structure including memory signal transmission line in backside redistribution" (Taiwanese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,626,732, issued on May 12, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor structure including memory signal transmission line in backside redistribution" was invented by Ze-Xian Lu (Hsinchu, Taiwan), Po-Hsun Chu (Tainan, Taiwan), Bo Wei Wu (New Taipei, Taiwan) and Jung-Hsuan Chen (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes a substrate, a data storage element, and first and second bit line sets. The substrate has a front side and a backside and includes a substrate layer, a first active layer, and a second active layer. The second active layer is prox...