US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on May 12 for "Polishing tool and method" (Taiwanese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,623,317, issued on May 12, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Polishing tool and method" was invented by Te-Chien Hou (Kaohsiung City, Taiwan), Chi-hsiang Shen (Tainan City, Taiwan), Chen-Chi Tang (Hsinchu City, Taiwan) and Shich-Chang Suen (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a polishing tool and a methods for polishing a wafer or manufacturing a semiconductor device. A method for polishing a wafer includes contacting a surface of the wafer to a polishing pad at an interface; rotating the wafer and/or the pad; and delivering a series of selected treatment agents...