US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on May 12 for "Method of removing a by-product from a component of a semiconductor apparatus" (Taiwanese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,582, issued on May 12, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Method of removing a by-product from a component of a semiconductor apparatus" was invented by Ren-Guan Duan (Hsinchu, Taiwan), Chen-Hsiang Lu (Hsin-Chu City, Taiwan), Chin-Feng Lin (Hsinchu County, Taiwan) and Tung-Hsiung Liu (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of removing a nitride-containing by-product from a component of a semiconductor apparatus includes heating the component to a predetermined temperature for a predetermined duration, wherein the nitride-containing by-product is transformed into an oxide...