US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on May 12 for "Brush for cleaning wafers after chemical mechanical polishing (CMP) process" (Taiwanese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,624,138, issued on May 12, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Brush for cleaning wafers after chemical mechanical polishing (CMP) process" was invented by Jhih-Fong Lin (Hsinchu, Taiwan), Liqing Wen (Hsinchu, Taiwan), Le Lu (Taipei, Taiwan) and Deng-Gao Chen (Taoyuan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Brushes for cleaning wafers after a Chemical Mechanical Polishing (CMP) process and methods for fabricating such brushes are provided. An exemplary method for fabricating a brush for cleaning wafers after a Chemical Mechanical Polishing (CMP) process includes forming a brush configured for...