US Patent Issued to Taiwan Semiconductor Manufacturing on March 31 for "Three-dimensional semiconductor device and method" (Taiwanese Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,704, issued on March 31, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Three-dimensional semiconductor device and method" was invented by Jeng-An Wang (Hsinchu, Taiwan), Sheng-Chi Lin (Yilan County, Taiwan), Hao-Cheng Hou (Hsinchu, Taiwan), Tsung-Ding Wang (Tainan, Taiwan) and Chien-Hsun Lee (Chu-tung Town, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments provide a method of performing a carrier switch for a device wafer, attaching a second wafer and removing a first wafer. A buffer layer is deposited over the device wafer, buffer layer reducing the topography of the surface of the device wafer. Af...