US Patent Issued to Taiwan Semiconductor Manufacturing on March 31 for "Three dimensional MIM capacitor having a comb structure and methods of making the same" (Taiwanese Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,682, issued on March 31, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Three dimensional MIM capacitor having a comb structure and methods of making the same" was invented by Che Wei Yang (Hsinchu, Taiwan), Tsun-Kai Tsao (Tainan City, Taiwan), Sheng-Chau Chen (Tainan City, Taiwan), Sheng-Chan Li (Tainan City, Taiwan) and Cheng-Yuan Tsai (Chu-Pei city, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Metal-insulator-metal (MIM) capacitor, an integrated semiconductor device having a MIM capacitor and methods of making. The MIM capacitor includes a first metal layer, a second metal layer and a dielectric layer lo...