US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on March 31 for "Semiconductor device and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,732, issued on March 31, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor device and manufacturing method thereof" was invented by Kai-Fung Chang (Hsinchu, Taiwan), Chin-Wei Liang (Hsinchu, Taiwan), Sheng-Feng Weng (Hsinchu, Taiwan), Ming-Yu Yen (Hsinchu, Taiwan), Cheyu Liu (Hsinchu, Taiwan), Hung-Chih Chen (Hsinchu, Taiwan), Yi-Yang Lei (Hsinchu, Taiwan), Ching-Hua Hsieh (Hsinchu, Taiwan) and Hung-Chou Liao (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device and a manufacturing method thereof are provided. The semiconductor device includes a redistribution layer (R...