US Patent Issued to Taiwan Semiconductor Manufacturing on March 31 for "Integrated circuit package and method" (Taiwanese Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,672, issued on March 31, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Integrated circuit package and method" was invented by Hsien-Pin Hu (Zhubei, Taiwan), Shang-Yun Hou (Jubei, Taiwan) and Shih-Wen Huang (Shuishang Township, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A device package including an interposer. The interposer comprising: a semiconductor substrate; first through vias extending through the semiconductor substrate; an interconnect structure comprising: a first metallization pattern in an inorganic insulating material; and a passivation film over the first metallization pattern; and a first r...