US Patent Issued to Taiwan Semiconductor Manufacturing on March 31 for "Electroplating system including an improved base structure" (Taiwanese Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,590,381, issued on March 31, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Electroplating system including an improved base structure" was invented by Chia-Sheng Lai (Taipei, Taiwan), Chun-Yuan Hsu (Hsinchu, Taiwan) and Tzu-Chung Tsai (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A base structure in an electroplating system is provided. The base structure includes: includes: an annular member; a contact ring attached to an inner surface of the annular member and configured to be electrically connected to a wafer in an electroplating process; and a pair of shield structures attached to an upper surface...