US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on March 3 for "Semiconductor structure and method of manufacturing the same" (Taiwanese, American Inventors)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,866, issued on March 3, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor structure and method of manufacturing the same" was invented by Pei-Haw Tsao (Tai-Chung, Taiwan), An-Tai Xu (Cupertino, Calif.), Huang-Ting Hsiao (Taoyuan County, Taiwan) and Kuo-Chin Chang (Chiayi, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes a semiconductor chip, a substrate and a plurality of bump segments. The bump segments include a first group of bump segments and a second group of bump segments collectively extended from an active surface of the semiconductor chip toward the subs...