US Patent Issued to Taiwan Semiconductor Manufacturing on March 3 for "Semiconductor package including lid with integrated heat pipe for thermal management and methods for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,820, issued on March 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor package including lid with integrated heat pipe for thermal management and methods for forming the same" was invented by Yu-Sheng Lin (Zhubei, Taiwan), Shu-Shen Yeh (Hsinchu, Taiwan), Chin-Hua Wang (New Taipei City, Taiwan), Po-Yao Lin (Zhudong Township, Taiwan) and Shin-Puu Jeng (Po-Shan Village, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package including a lid having one or more heat pipes located on and/or within the lid to provide improved thermal management. A lid for a semiconductor package having on...