US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on March 3 for "Semiconductor device including image sensor and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,706, issued on March 3, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor device including image sensor and methods of forming the same" was invented by Ming-Hsien Yang (Taichung, Taiwan), Chun-Hao Chou (Tainan, Taiwan), Kuo-Cheng Lee (Tainan, Taiwan) and Chung-Liang Cheng (Changhua, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device is provided. The device comprises first semiconductor wafer comprising first BEOL structure disposed on first side of first substrate, the first BEOL structure comprising first metallization layer disposed over the first substrate, second metalliz...