ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,786, issued on March 3, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).
"Processing tool and method" was invented by Chi-Hsiang Shen (Tainan, Taiwan), Jeng-Chi Lin (Hsinchu, Taiwan), Te-Chien Hou (Kaohsiung, Taiwan), Che-Hao Tu (Hsinchu, Taiwan), Tang-Kuei Chang (Hsinchu, Taiwan), Kei-Wei Chen (Tainan, Taiwan) and Hui-Chi Huang (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are a tool and a method for processing a semiconductor wafer. A processing method includes supporting a semiconductor wafer continuously along a periphery of the semiconductor wafer with an electrically grounded conduct...