US Patent Issued to Taiwan Semiconductor Manufacturing on March 3 for "Package assembly including liquid alloy thermal interface material (TIM) and seal ring around the liquid alloy TIM and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,824, issued on March 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package assembly including liquid alloy thermal interface material (TIM) and seal ring around the liquid alloy TIM and methods of forming the same" was invented by Chin-Hua Wang (New Taipei City, Taiwan), Yu-Sheng Lin (Zhubei City, Taiwan), Po-Yao Lin (Zhudong Township, Taiwan), Ming-Chih Yew (Hsinchu City, Taiwan) and Shin-Puu Jeng (Po-Shin Village, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package assembly includes an interposer module on a package substrate, a liquid alloy thermal interface material (TIM) on the interposer module,...