ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,472, issued on March 24, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).
"Via accuracy measurement" was invented by Wei-Hsuen Lee (Hsinchu City, Taiwan), Hung En Hsu (Taipei City, Taiwan) and Kuo-Ching Hsu (Taipei, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Methods and pad structures to test via accuracy are provided. A method according to the present disclosure includes forming a first pad and a second pad on a device component, wherein the second pad includes a via landing area and a clearance opening, providing a core substrate that includes a cavity, placing the device component in the cavity, formi...