US Patent Issued to Taiwan Semiconductor Manufacturing on March 24 for "Thermal and mechanical enhanced thermal module structure on heterogeneous packages and methods for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,505, issued on March 24, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Thermal and mechanical enhanced thermal module structure on heterogeneous packages and methods for forming the same" was invented by Sheng-Liang Kuo (Hsinchu, Taiwan), Po-Yao Lin (Zhudong Township, Taiwan), Kathy Yan (Hsinchu, Taiwan) and Cooper Yu (Taipei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Devices and method for forming a chip package assembly, including a package substrate, a fan-out package attached to the package substrate, the fan-out package including a first semiconductor die including a first physical interface a...