ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,283, issued on March 24, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).
"Semiconductor structure and related methods" was invented by Feng-Ching Chu (Pingtung County, Taiwan), I-Hsieh Wong (Hsinchu, Taiwan), Wei-Yang Lee (Taipei City, Taiwan) and Chia-Pin Lin (Hsinchu County, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Methods and associated devices including the fabrication of a semiconductor structure that provides a silicon-on-insulator substrate. The semiconductor structure may be formed by providing a base substrate, forming a sacrificial layer over the base structure, and forming a semiconductor l...