US Patent Issued to Taiwan Semiconductor Manufacturing on March 24 for "Semiconductor devices with implanted STI regions and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,234, issued on March 24, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor devices with implanted STI regions and methods of forming the same" was invented by I-Ming Chang (Hsinchu, Taiwan), Yao-Sheng Huang (Hsinchu, Taiwan), Hsiang-Pi Chang (Hsinchu, Taiwan), Yi-Ruei Jhan (Hsinchu, Taiwan) and Huang-Lin Chao (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for fabricating semiconductor devices includes forming a stack structure protruding from a substrate and including a plurality of first semiconductor layers and a plurality of second semiconductor layers stacked on top of one an...