US Patent Issued to Taiwan Semiconductor Manufacturing on March 24 for "Packaging substrate including an underfill injection opening and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,525, issued on March 24, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Packaging substrate including an underfill injection opening and methods of forming the same" was invented by Hao-Cheng Hou (Hsinchu City, Taiwan), Tsung-Ding Wang (Tainan, Taiwan), Jung Wei Cheng (Hsinchu City, Taiwan) and Yu-Min Liang (Zhongli City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An assembly including at least one semiconductor die and an interposer is provided. A packaging substrate including substrate bonding pads is provided. The packaging substrate includes a first horizontal surface facing the assembly, a second hor...