US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on March 24 for "Method for forming semiconductor redistribution structures" (Taiwanese Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,482, issued on March 24, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan).

"Method for forming semiconductor redistribution structures" was invented by Chih-Chia Hu (Taipei, Taiwan), Yu-Hsiung Wang (Zhubei City, Taiwan) and Ming-Fa Chen (Taichung City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An embodiment is a method including forming a first interconnect structure over a first substrate, forming a redistribution via over the first interconnect structure, the redistribution via being electrically coupled to at least one of the metallization patterns of the first interconnect structure, forming a redistribu...