US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on March 17 for "Semiconductor device structure and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,704, issued on March 17, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor device structure and method for forming the same" was invented by Kuan-Ting Pan (Taipei City, Taiwan), Che-Lun Chang (Hsinchu, Taiwan), Kuo-Cheng Chiang (Zhubei City, Taiwan) and Chih-Hao Wang (Baoshan Township, Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure and a method for forming the same are provided. The semiconductor device structure includes a substrate having a first region and a second region, and a plurality of first nanostructures stacked in a vertical direction in the...