US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on March 17 for "Photoresist and method of manufacturing a semiconductor device" (Taiwanese Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,578,641, issued on March 17, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Photoresist and method of manufacturing a semiconductor device" was invented by Chieh-Hsin Hsieh (Hsinchu County, Taiwan), Wei-Han Lai (New Taipei, Taiwan) and Ching-Yu Chang (Yilang County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A photoresist includes a solvent, a polymer and an additive. The polymer is dissolved in the solvent, and the additive is dispersed in the solvent. The additive includes a double bond or includes an epoxy group. The additive has a surface tension different from a surface tension of the polymer."

The ...