US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on March 17 for "Pellicle for an EUV lithography mask and a method of manufacturing thereof" (Taiwanese Inventor)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,578,635, issued on March 17, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Pellicle for an EUV lithography mask and a method of manufacturing thereof" was invented by Yun-Yue Lin (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A pellicle for a reflective photo mask includes a frame, a core layer having a front surface and a rear surface, and disposed over the frame, a first capping layer disposed on the front surface of the core layer, an anti-reflection layer disposed on the first capping layer, a barrier layer disposed on the anti-reflection layer, and a heat emissive layer disposed on the ba...