US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on March 17 for "Method for manufacturing semiconductor structure" (Taiwanese Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,577,099, issued on March 17, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Method for manufacturing semiconductor structure" was invented by Yi-Chuan Teng (Hsinchu County, Taiwan), Ching-Kai Shen (Hsinchu County, Taiwan) and Jung-Kuo Tu (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a semiconductor structure is provided. The method includes the operations as follows. A first substrate having a top surface is received. A semiconductor layer is formed over the first substrate. A cavity is formed at the top surface of the semiconductor layer. A second substrate is bonde...