US Patent Issued to Taiwan Semiconductor Manufacturing on March 17 for "Bond structure having shielding structures for stacked IC chips" (Taiwanese Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,764, issued on March 17, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Bond structure having shielding structures for stacked IC chips" was invented by Hao-Lin Yang (Kaohsiung City, Taiwan), Kuan-Chieh Huang (Hsinchu City, Taiwan), Wei-Cheng Hsu (Kaohsiung City, Taiwan), Tzu-Jui Wang (Fengshan City, Taiwan), Chen-Jong Wang (Hsin-Chu, Taiwan) and Dun-Nian Yaung (Taipei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Various embodiments of the present disclosure are directed towards an integrated circuit (IC) including a first IC chip bonded to a second IC chip. The first IC chip includes a plurality of p...